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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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Panel Level Packaging Form

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Panel Level Packaging Chip

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Panel Level Packaging Product Structure

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Fan Out Panel Level Packaging

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TGV Through Glass Via

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Packaging Simulation Experiments

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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Package Suitable For Various Packaging Simulation Experiments
Package Suitable For Various Packaging Simulation Experiments
  • Package Suitable For Various Packaging Simulation Experiments
Products Detailed
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2...
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