Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Guangdong Fozhixin (FZX）microelectronic technology research Pte Ltd was registered in Foshan city, Guangdong province of PRC, 2018. FZX was focus on panel level packaging technology development and mass production. At present, FZX has a factory which was about more than 2000 meter square. In addition, there is another mass production site being built up with more than 5000 meter square in Foshan city as well. MOS chip package, GaN package and LED/driver one package, etc. are major products that are shipped to the final customers. FZX also delivered the glass core substrate to the customers and owned the mass production capability with more than 3000 glass panels (size with 510mmX 515mm) output per month. FZX has own more than 180 IPs that were ranked No.4 world wide in fan-out field. FZX is a leading OSAT on panel level packaging (PLP) and provides engineering and mass production service for more than 100 customers of global market. Trust and delight customers are always company core culture and value. It is always a great honour to serve you and make you better.
| Company Name: | Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. |
|---|---|
| Business Type: | Manufacturer |
| Brands: | FZX |
| Employee Number: | 101~120 |
| Year Established: | 2018 |
| Total Sales Annual: | 10000000-50000000 |
| Company Location: | Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province |
| Factory Location: | Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province |
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
1. Innovative Panel level Fan out packaging process
2. Combination of semiconductor and Substrate technology
3. 100% independent intellectual property rights
FoZhiXin (FZX) Microelectronics Research Pte Ltd was established in September 2018, Foshan City, Guangdong province.
Provincial manufacturing innovation center
Panel level fan-out packaging research center
Sample build (PLP)started in 2021
Small scale production(PLP+ Glass Core) in 2023
Full scale production plan in 2024
Guangdong Fozhixin (FZX）microelectronic technology research Pte Ltd was registered in Foshan city, Guangdong province of PRC, 2018. FZX was focus on panel level packaging technology development and mass production. At present, FZX has a factory which was about more than 2000 meter square. In addition, there is another mass production site being built up with more than 5000 meter square in Foshan city as well. MOS chip package, GaN package and LED/driver one package, etc. are major products that are shipped to the final customers. FZX also delivered the glass core substrate to the customers and owned the mass production capability with more than 3000 glass panels (size with 510mmX 515mm) output per month. FZX has own more than 180 IPs that were ranked No.4 world wide in fan-out field. FZX is a leading OSAT on panel level packaging (PLP) and provides engineering and mass production service for more than 100 customers of global market. Trust and delight customers are always company core culture and value. It is always a great honour to serve you and make you better.
| Market name: | Worldwide |
|---|---|
| Contact Person: | LIN TINGYU |