Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
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TGV Through Glass Via

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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 TGV Through Glass Via

high aspect ratio TGV Foundary Capabilities for semiconductor packaging

Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The .....
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High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips

Description: As shown below photo, the blind or through holes can be made with angle controlling, the laser and acid methodology can be combined ...
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High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm

Description: The panel level PVD can be performed at both sides of the panel simultaneously. It is high efficient and time saving process. The panel ....
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Glass Substrate Technology-Plating Double Side Stable And Easily Maintain

Description: The panel plating machine is used for plating, Plating uniformity can achieve below 10%,High aspect ratio of glass through-hole plating ....
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12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness

Description: This product is manufactured and consist of 12 layers which top and bottom have five layers and glass core has two layers, respectively. ...
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Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen

Description: As shown in the following photo, the glass core substrate (with ABF protection) is experienced for drop test (1.5m high and different ...
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Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test

Competitive Advantage: 1. Pass the reliability test on MSL 3/HAST/TC. 2. More reliable and consistent reliability performance. 3. X-ray, C-SAM are ...
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