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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Panel Level Packaging Form

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Panel Level Packaging Form

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Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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1 - 10 of 24

 Products
China 310*320mm Panel Size Panel Level QFN Low Electrical Resistance for sale

310*320mm Panel Size Panel Level QFN Low Electrical Resistance

Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process ...
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China 0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter for sale

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process ...
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China Panel Level Packaging Panel Level SiP Used In Various Industries for sale

Panel Level Packaging Panel Level SiP Used In Various Industries

Description: 310*320mm panel size; Advantage:Small SiP package size,such as 6*6mm/7.5*7.5mm;low power consumption;multi-chip packages, high assembly ....
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China 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption for sale

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP ...
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China LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm for sale

LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the .....
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China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon） for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）

Description: Chip size: 0.76*0.61; 1.43 * 1.06； Package size: 2.76*1.97; 2.58 * 2.92； Package thickness: 360um； Process introduction: After the chip ....
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China 310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon） for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）

Description: Panel size:310*320mm; Package size: 12*18*0.9mm; Package thickness: 0.9mm; Brief introduction to the process: After the temporary carrier ...
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China Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability for sale

Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipatio...
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China Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump for sale

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump

Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement ...
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China Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball for sale

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball

Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond ...
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