Products Suppliers Sign in Register

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
Home Products Catalog Company Profile Quality Control Contact Us Request a Quota
English
Home / Products /

Fan Out Panel Level Packaging

Product Categories

Panel Level Packaging Form

 [3]

Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
Contact Now
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
View Contact Details
Contact Now
1 - 5 of 5

 Fan Out Panel Level Packaging
China 310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product

310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down ...
Contact Now

Add to Cart
China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF) for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

Description: Panel size:310*320mm Package size: 7*6mm Package thickness: 0.75mm Process flow: The Face down packaging method is adopted for mounting, ...
Contact Now

Add to Cart
China 310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package

Description: Plating uniformity: ≤10%; Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.78mm; Process type: FOPLP (310X320mm); ...
Contact Now

Add to Cart
China 310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED

Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the .....
Contact Now

Add to Cart
China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package

Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process ...
Contact Now

Add to Cart
Inquiry Cart 0

Home Products Suppliers About Us Contact Us Help Site Map 公司介绍 联系我们

Français Русский язык Español 日本語 Português

China Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0~9

Copyright © 2009-2025 Everychina.com. All rights reserved. 京ICP备09074326号-4