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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Panel Level Packaging Form

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Panel Level Packaging Form

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Panel Level Packaging Chip

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Fan Out Panel Level Packaging

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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 Panel Level Packaging Form
China 310*320mm Panel Size Panel Level QFN Low Electrical Resistance for sale

310*320mm Panel Size Panel Level QFN Low Electrical Resistance

Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process ...
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China 0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter for sale

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process ...
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China Panel Level Packaging Panel Level SiP Used In Various Industries for sale

Panel Level Packaging Panel Level SiP Used In Various Industries

Description: 310*320mm panel size; Advantage:Small SiP package size,such as 6*6mm/7.5*7.5mm;low power consumption;multi-chip packages, high assembly ....
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