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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Panel Level Packaging Chip

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Panel Level Packaging Form

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Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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 Panel Level Packaging Chip
China 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption for sale

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP ...
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China LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm for sale

LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the .....
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China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon） for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）

Description: Chip size: 0.76*0.61; 1.43 * 1.06； Package size: 2.76*1.97; 2.58 * 2.92； Package thickness: 360um； Process introduction: After the chip ....
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China 310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon） for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）

Description: Panel size:310*320mm; Package size: 12*18*0.9mm; Package thickness: 0.9mm; Brief introduction to the process: After the temporary carrier ...
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