Contact Information
Contact Person:
MrLIN TINGYU
Company Name:
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Company Location:
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
Factory Location:
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
Employee Number:
101~120
Business Type:
Manufacturer
Brands:
FZX
Website:
https://www.fozhixinsmc.com/
310*320mm Panel Size Panel Level QFN Low Electrical Resistance
0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter
Panel Level Packaging Panel Level SiP Used In Various Industries
310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）
Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability
Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball
Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package
310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product
310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
