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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Manufacturer from China
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1 Years
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Panel Level Packaging Product Structure

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Panel Level Packaging Form

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Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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 Panel Level Packaging Product Structure
China Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability for sale

Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipatio...
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China Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump for sale

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump

Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement ...
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China Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball for sale

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball

Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond ...
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China Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package for sale

Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package

Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated ....
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