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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / Panel Level Packaging Form / 310*320mm Panel Size Panel Level QFN Low Electrical Resistance /

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Panel Level Packaging Form

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Panel Level Packaging Chip

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Panel Level Packaging Product Structure

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Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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310*320mm Panel Size Panel Level QFN Low Electrical Resistance
310*320mm Panel Size Panel Level QFN Low Electrical Resistance
  • 310*320mm Panel Size Panel Level QFN Low Electrical Resistance
Products Detailed
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process ...
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