Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
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Description:
310*320mm panel size;
Package size: 2.0*2.0mm;
Package thickness: 0.5mm;
Chip size: 1.0*1.6mm;
Process type: FOPLP (Face Up);
Process introduction:
After the chip is picked and placed onto the temporary carrier board, the packaging process is carried out by compression molding, plasma clean, laser opening/double-sided sputtering(Ti/Cu), and then continue to perform double-sided lithography/electroplating. Finally the plastic compression molding is carried out again, and then OSP is performed on the pad surface, and after that a final package is completed and final product is shipped to the customers.
Applications:
Power adapter, power amplifier, automotive electronics, etc
Specifications:
310*320mm panel size;
Package size: 2.0*2.0mm;
Package thickness: 0.5mm;
Chip size: 1.0*1.6mm;
Process type: FOPLP (Face Up);
Competitive Advantage:
1,Low electrical resistance , such as 0.1,0.2 mohm
2,Low power consumption
3,High efficient heat dissipation
4,Thin package
5,Low price