Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
Home / Products / Panel Level Packaging Chip /

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

Contact Now
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
Contact Now

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

Ask Latest Price
Brand Name :FZX Fanout Process and Product
Model Number :Multi-chip MOSFET
Place of Origin :PR China
MOQ :3000pcs
Payment Terms :T/T
Supply Ability :stable
Delivery Time :1 month
Contact Now

Add to Cart

Find Similar Videos
View Product Description

Description:

Multi-chip MOSFET

310*320mm panel size;

Package size: 2.0*2.0mm;

Package thickness: 0.5mm;

Chip size: 1.0*1.6mm;

Process type: FOPLP (Face Up);

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

Applications:

Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc.

Competitive Advantage:

1,Low electrical resistance , such as 0.1,0.2

2,Low power consumption

3,High efficient heat dissipation

4,Thin package

5,Low price

Inquiry Cart 0