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Panel Level Packaging Product Structure

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）

Name: 310320mm FanOut Panel Level Packaging FOPLPIC ChipSilicon
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :FZX-IC Chip

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

Panel size:310*320mm;

Package size: 12*18*0.9mm;

Package thickness: 0.9mm;

Brief introduction to the process: After the temporary carrier board is attached, plastic sealing and chip reconstruction are done, the first layer of RDL is made, followed by etching +ABF pressing + laser drilling + second layer of RDL, and finally green oil solder mask + nickel-palladium metal is the final protective layer attached.

Applications:

computer

Specifications:

Panel size:310*320mm;

Package size: 12*18*0.9mm;

Package thickness: 0.9mm;

Competitive Advantage:

1,Improve function density

2,shorten interconnection length

3,system reconfiguration

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