Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

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Description:

1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu).

2,It can be used in various application scenarios such as power management, new energy vehicles, photovoltaics, etc., and has massive market prospects.

Applications:

Usually used for multi-chip integration on the carrier board.

Competitive Advantage:

1. High heat dissipation can help package to reduce the the impact of reliability.

2. Multi- die with different heights of bump assembly can be assembled in one package.

3. Low cost.

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Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

Panel Level Packaging Form

Panel Level Packaging Chip

Panel Level Packaging Product Structure

Fan Out Panel Level Packaging

TGV Through Glass Via

Packaging Simulation Experiments

Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability