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Panel Level Packaging Product Structure

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Packaging Simulation Experiments

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball

Name: FanOut Panel Level Packaging FOPLPProduct StructureFace UpWire Bond Ball
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :Face up-wire bond ball

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and MOS chips can be integrated and packaged; It can be used in various application scenarios such as power management, new electric vehicles (EV) and robot arms, and has broad market prospects.

Applications:

It can be used in various application scenarios such as power management, new electric vehicles (EV) and robot arms, and has broad market prospects.

Competitive Advantage:

Low cost
Flexibility for manufacturing
Double side plating
Thick Cu for heat dissipation

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