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Panel Level Packaging Product Structure

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Packaging Simulation Experiments

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product

Name: 310320mm FanOut Panel Level Packaging FOPLP GaN Product
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :FZX-GaN

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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310*320mm Panel size;

DIE1 size:1.89*1.64mm;

DIE2 size:0.926*0.626mm;

Package size:6*7mm;

Package thickness: 0.42mm;

Process flow:

The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, the second layer of process is adding the green oil solder mask and nickel gold protection.

Applications:

Used in gallium nit-ride power devices, chargers, power equipment and other fields,Gallium nitride power devices, chargers, power supply equipment, etc

Competitive Advantage:

1. Thick Cu for high heat dissipation of the package

2. Simple process and low cost

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