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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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AI Chips

Name: High Efficiency Though HoleBlind Hole On Glass 35um For GPUCPUAI Chips
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :FZX-TH2

Certification :CE, Rohs, FCC

Place of Origin :PR China

MOQ :10 panel

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

As shown below photo, the blind or through holes can be made with angle controlling, the laser and acid methodology can be combined together to make customer specific holes. The glass can be coming from different suppliers, e.g., AF32/BF33 (Schott), EAGLE XG or AGC, etc. The shape of hole, uniformity of hole, can be controlled as well.

Panel size: 510mmX515mm or below (can combined different size for fitting the size of 510mmX515mm)

Panel thickness: 0.2mm-5mm

Accuracy of position:1mu

Efficiency of hole manufacturing: 2000-5000 holes/second

Aperture: 35/30(top/middle)

Density of hole: 3um-200um (diameter)

Applications:

Used for GPU/CPU/AI chips on super computing, sever, cloud application.

Competitive Advantage:

“X”shape hole and vertical hole can be controlled and made and meet the customer requirement.
Aspect ratio hole can be steadily controlled within 1:10-1:20
Different density of TGV holes can be manufactured within one panel.

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