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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm

Name: High Efficient Glass Substrate Panel Size 510515mm PVD 300mm600mm
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :FZX-PVD2

Certification :CE, Rohs, FCC

Place of Origin :PR China

MOQ :10 panel

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

The panel level PVD can be performed at both sides of the panel simultaneously. It is high efficient and time saving process. The panel sizes are varied within 300mm-600mm. Ti/Cu can be performed as the seed layers. The thickness is controlled with 0.1-2 micro meters. The uniformity in controlled with 5%. normal process time of PVD (Ti/Cu:0.1/0.5 um) can be finished within 30 minutes. The typical PVD description can be shown below.

Panel size:510*515mm

Metal: Ti/Cu

Film thickness uniformity: ≤5%

Applications:

Used for GPU/CPU/AI chips on super computing, sever, cloud application.

Competitive Advantage:

1. Seed layers for plating

2. Uniformity is within 5%

3. Good adhesion between Cu and substrate

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