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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / TGV Through Glass Via / 12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness /

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Panel Level Packaging Form

 [3]

Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness
12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness
  • 12 Layers ABF Additive Lamination Process-12L 700μM Glass Thickness
Products Detailed
Description: This product is manufactured and consist of 12 layers which top and bottom have five layers and glass core has two layers, respectively. ...
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