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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / TGV Through Glass Via / Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen /

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Panel Level Packaging Form

 [3]

Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen
Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen
  • Robust Glass Subatrate Reliability-Drop Test No Glass Cracks Happen
Products Detailed
Description: As shown in the following photo, the glass core substrate (with ABF protection) is experienced for drop test (1.5m high and different ...
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