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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Manufacturer from China
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1 Years
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Home / Products / TGV Through Glass Via / Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test /

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Panel Level Packaging Form

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Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test
Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test
  • Reliable Performance Glass Subatrate Reliability-MSL3/HAST/TCT Test
Products Detailed
Competitive Advantage: 1. Pass the reliability test on MSL 3/HAST/TC. 2. More reliable and consistent reliability performance. 3. X-ray, C-SAM are ...
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