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Panel Level Packaging Product Structure

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）

Name: 310320mm FanOut Panel Level Packaging FOPLP Resistance ChipSilicon
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :Resistance chip

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

Chip size: 0.76*0.61; 1.43 * 1.06；

Package size: 2.76*1.97; 2.58 * 2.92；

Package thickness: 360um；

Process introduction:

After the chip is reconstructed to the temporary carrier board, the pick and placement is performed and later plastic compressive molding, followed by grinding, laser opening, and then laser + electroplating.

Applications:

Power management；

Specifications:

Chip size: 0.76*0.61; 1.43 * 1.06；

Package size: 2.76*1.97; 2.58 * 2.92；

Package thickness: 360um；

Competitive Advantage:

High precision, fast response,low power consumption and stability.

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