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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / Panel Level Packaging Chip / 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon） /

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Panel Level Packaging Form

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Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
Products Detailed
Description: Chip size: 0.76*0.61; 1.43 * 1.06； Package size: 2.76*1.97; 2.58 * 2.92； Package thickness: 360um； Process introduction: After the chip ...
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