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Panel Level Packaging Product Structure

[4]

Packaging Simulation Experiments

[1]

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump

Name: FanOut Panel Level Packaging FOPLPProduct StructureFace UpWafer Bump
Brand: FZX Fan-Out Panel Level Packaging
Price: 1 USD

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Brand Name :FZX Fan-Out Panel Level Packaging

Model Number :Face up-wafer bump

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surface treanment and laser cutting will be performed. The process is simple and has the advantage of low cost.

Competitive Advantage:

Using the bump of chip can be grinded after C mold, RDL can be made along the surface of molding
Thick copper (20-50um)can be made to increase the heat dissipation.
Double side plating can be performed simultaneously
Low cost

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