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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / Panel Level Packaging Product Structure / Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump /

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Panel Level Packaging Form

 [3]

Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
  • Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Products Detailed
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement ...
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