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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

Name: 310320mm FanOut Panel Level Packaging FOPLP Radio Frequency RF
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :Radio Frequency (RF)

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

Panel size:310*320mm

Package size: 7*6mm

Package thickness: 0.75mm

Process flow:

The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, the second layer of process is adding the green oil solder mask and nickel gold protection. Dk and Df are required to maintain the low value for RF products.

Specifications:

Panel size:310*320mm

Package size: 7*6mm

Package thickness: 0.75mm

Competitive Advantage:

1. Maintaining low lose for RF products.

2. Low cost and high integration for multi-RF module

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