Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

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Brand Name :FZX Fanout Process and Product
Model Number :Radio Frequency (RF)
Place of Origin :PR China
MOQ :3000pcs
Payment Terms :T/T
Supply Ability :stable
Delivery Time :1 month
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Description:

Panel size:310*320mm

Package size: 7*6mm

Package thickness: 0.75mm

310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

Process flow:

The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, the second layer of process is adding the green oil solder mask and nickel gold protection. Dk and Df are required to maintain the low value for RF products.

Specifications:

Panel size:310*320mm

Package size: 7*6mm

Package thickness: 0.75mm

Competitive Advantage:

1. Maintaining low lose for RF products.

2. Low cost and high integration for multi-RF module

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