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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / Fan Out Panel Level Packaging / 310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF) /

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Panel Level Packaging Form

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Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
Products Detailed
Description: Panel size:310*320mm Package size: 7*6mm Package thickness: 0.75mm Process flow: The Face down packaging method is adopted for mounting, ...
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