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Panel Level Packaging Form

Panel Level Packaging Chip

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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Name: 310320mm FanOut Panel Level Packaging FOPLP MEMS Microphone Package
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :MEMS

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

Plating uniformity: ≤10%;

Package size: 3*2mm;

Package thickness: 0.26mm;

Chip size: 0.96*0.78mm;

Process type: FOPLP (310X320mm);

Applications:

Mobile phone, Bluetooth headset,MEMS, wearable electronics.

Specifications:

Package size: 3*2mm;

Package thickness: 0.26mm;

Chip size: 0.96*0.78mm;

Competitive Advantage:

Low cost, simple structure,high yield

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