Products Suppliers Sign in Register

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
Home Products Catalog Company Profile Quality Control Contact Us Request a Quota
English
Home / Products / Fan Out Panel Level Packaging / 310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package /

show pictures

Product Categories

Panel Level Packaging Form

 [3]

Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
Contact Now
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
View Contact Details
Contact Now

310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
Products Detailed
Description: Plating uniformity: ≤10%; Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.78mm; Process type: FOPLP (310X320mm); ...
View Products Detailed →

Home Products Suppliers About Us Contact Us Help Site Map 公司介绍 联系我们

Français Русский язык Español 日本語 Português

China Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0~9

Copyright © 2009-2025 Everychina.com. All rights reserved. 京ICP备09074326号-4