Product Categories

Panel Level Packaging Form

[3]

Panel Level Packaging Chip

[4]

Panel Level Packaging Product Structure

[4]

Fan Out Panel Level Packaging

[5]

TGV Through Glass Via

[7]

Packaging Simulation Experiments

[1]

Contact Now

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

View Contact Details

Contact Now

Micro LED

Name: 310320mm FanOut Panel Level Packaging FOPLP CPOMiniMicro LED
Brand: FZX Fanout Process and Product
Price: 1 USD

Ask Latest Price

Brand Name :FZX Fanout Process and Product

Model Number :FZX-CPO/mini/micro LED

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

Contact Now

Add to Cart

View Product Description

Description:

LED constant current driver chip;

Chip size 0.4mm*0.555mm*0.20mm;

Panel size 310*320mm;

Package size 122mm*50mm;

Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating.

Applications:

Mini-LED, lamps

Specifications:

Chip size 0.4mm*0.555mm*0.20mm;

Panel size 310*320mm;

Package size 122mm*50mm;

Competitive Advantage:

1. high assembly efficiency

2. Simple process and low cost

Inquiry Cart 0