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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / Fan Out Panel Level Packaging / 310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED /

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Panel Level Packaging Form

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Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
  • 310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
Products Detailed
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the ...
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