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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package wholesale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package

Name: 310320mm FanOut Panel Level Packaging FOPLP Power Package
Brand: FZX Fanout Process and Product
Price: 1 USD

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Brand Name :FZX Fanout Process and Product

Model Number :FZX- power package

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

310*320mm panel size;

Package size: 2.0*2.0mm;

Package thickness: 0.5mm;

Chip size: 1.0*1.6mm;

Process type: FOPLP (Face Up);

Process flow: face up encapsulation method is adopted. After a single patch, bump, plastic sealing and grinding (exposing the ball), then punch holes and electroplating to guide the upper and lower lines, and finally make a protective layer.

Applications:

New energy vehicles, power management, etc

Specifications:

310*320mm panel size;

Package size: 2.0*2.0mm;

Package thickness: 0.5mm;

Chip size: 1.0*1.6mm;

Competitive Advantage:

1,High efficient heat dissipation

2,Thin package

3,Low price

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