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Panel Level Packaging Form

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Panel Level Packaging Chip

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Panel Level Packaging Product Structure

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Fan Out Panel Level Packaging

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package

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Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process ...

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