Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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high aspect ratio TGV Foundary Capabilities for semiconductor packaging

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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high aspect ratio TGV Foundary Capabilities for semiconductor packaging

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Brand Name :FZX -TGV
Model Number :TGV Foundary
Place of Origin :PR China
MOQ :10 panel
Payment Terms :T/T
Supply Ability :stable
Delivery Time :1 month
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Description:

As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:10 to 1:160. The line width/space can be varied from 10um to 15um. The most important factor here is the adhesion between glass and copper is controlled from 10N/cm to 15N/cm. The roughness of glass can be controlled well in order to keep high adhesion.

high aspect ratio TGV Foundary Capabilities for semiconductor packaging

Applications:

1,In the field of semiconductor packaging, glass substrate can meet the needs of larger size packaging due to its significant electrical and mechanical performance advantages, and become an important direction for the development of advanced packaging in the future.

2,In the field of display technology, glass substrates are widely used in the manufacture of liquid crystal displays and other flat panel display devices, such as tablet PCs, cell phones, and TVs.

Competitive Advantage:

  • Very high aspect ratio (diameter/thickness of the glass): 1:10-1:160
  • Very high adhesion strength between copper and glass
  • Several glass types can be used in the production line, process window is wider.
  • Shape of glass, uniformity and angle can be steadily controlled.

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