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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

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1 Years
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Home / Products / TGV Through Glass Via / high aspect ratio TGV Foundary Capabilities for semiconductor packaging /

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Panel Level Packaging Form

 [3]

Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
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high aspect ratio TGV Foundary Capabilities for semiconductor packaging
high aspect ratio TGV Foundary Capabilities for semiconductor packaging
  • high aspect ratio TGV Foundary Capabilities for semiconductor packaging
Products Detailed
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The ...
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