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Panel Level Packaging Form

Panel Level Packaging Chip

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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

City:foshan

Province/State:guangdong

Country/Region:china

Contact Person:MrLIN TINGYU

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Brand Name :FZX

Place of Origin :PR China

MOQ :3000pcs

Payment Terms :T/T

Supply Ability :stable

Delivery Time :1 month

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Description:

1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation.

2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized.

3. Key process feasibility simulation analysis from wafer level to package level.

4. Package reliability simulation verification under external load environment such as heat and force.

Competitive Advantage:

1. Verify the process model and electrical and mechanical model

2. Using the model to predict the behavior of the product under the actual environment

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