Products Suppliers Sign in Register

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
Home Products Catalog Company Profile Quality Control Contact Us Request a Quota
English
Home / Products /

Panel Level Packaging Form, Panel Level Packaging Chip

Product Categories

Panel Level Packaging Form

 [3]

Panel Level Packaging Chip

 [4]

Panel Level Packaging Product Structure

 [4]

Fan Out Panel Level Packaging

 [5]

TGV Through Glass Via

 [7]

Packaging Simulation Experiments

 [1]
Contact Now
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
City:foshan
Province/State:guangdong
Country/Region:china
Contact Person:MrLIN TINGYU
View Contact Details
Contact Now
Highlighted Products
View more »
China 310*320mm Panel Size Panel Level QFN Low Electrical Resistance for sale

310*320mm Panel Size Panel Level QFN Low Electrical Resistance

China 0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter for sale

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

China Panel Level Packaging Panel Level SiP Used In Various Industries for sale

Panel Level Packaging Panel Level SiP Used In Various Industries

China 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption for sale

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

China LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm for sale

LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon） for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）

China 310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon） for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）

China Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability for sale

Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

China Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump for sale

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump

China Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball for sale

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball

China Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package for sale

Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package

China 310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product

China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF) for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

China 310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package

China 310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED

China 310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package for sale

310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package

China high aspect ratio TGV Foundary Capabilities for semiconductor packaging for sale

high aspect ratio TGV Foundary Capabilities for semiconductor packaging

China High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips for sale

High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips

China High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm for sale

High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm

China Glass Substrate Technology-Plating Double Side Stable And Easily Maintain for sale

Glass Substrate Technology-Plating Double Side Stable And Easily Maintain

We Will Provide Quality Panel Level Packaging Form, Panel Level Packaging Chip, Panel Level Packaging Product Structure

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. in China
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Guangdong Fozhixin (FZX）microelectronic technology research Pte Ltd was registered in Foshan city, Guangdong province of PRC, 2018. FZX was focus on panel level packaging technology development and mass production. At present, FZX has...
Contact Now
Factory Tour → Quality Control →

Home Products Suppliers About Us Contact Us Help Site Map 公司介绍 联系我们

Français Русский язык Español 日本語 Português

China Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0~9

Copyright © 2009-2025 Everychina.com. All rights reserved. 京ICP备09074326号-4